STMicroelectronics

Ref. [hkinstmicroelectronics20220620][hkinbrandcloudAMpd]

Electronic circuits form a mostly invisible part of the world we live in today. These circuits are present in microchips or just "chips", which combine the latest advances in performance, intelligence and, efficiency. Hundreds or thousands of these chips are integrated into each of the millions and billions of electronic devices people across the globe interact with every day. It is in this unseen realm that STMicroelectronics creates the sparks that animate the products we use at any given moment. Our technology is found everywhere microelectronics makes a positive contribution to people's lives. Chips from ST embedding the most advanced innovations are an essential part of products as diverse as cars and key fobs, giant factory machines and data center power supplies, washing machines and hard disks, and smartphones and toothbrushes. We help our customers make these devices more intelligent, more energy efficient, more connected, safer and more secure.

Rated (4/5) based on 12 customer reviews

Description

IC SOC CORTEX-A9 KINTEX7 676FBGA Series: Zynq?-7000 Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? MCU Flash: - MCU RAM: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1GHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: 0~C ~ 100~C Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)

Part Number XC7Z030-3FBG676E
Main Category Integrated Circuits (ICs)
Sub Category Embedded - System On Chip (SoC)
Brand STMicroelectronics
Description IC SOC CORTEX-A9 KINTEX7 676FBGA
Series Zynq-7000
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM Cortex-A9 MPCore,with CoreSight,,-"
MCU Flash 256KB
MCU RAM DMA
Peripherals CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Connectivity 1GHz
Speed Kintex,7 FPGA, 125K Logic Cells
Primary Attributes 0°C ~ 100°C (TJ)
Operating Temperature 676-BBGA, FCBGA
Package / Case 676-FCBGA (27x27)
Supplier Device Package
Image Integrated Circuits (ICs)
Lowest Price: $1.84   Highest Price: $5.17
1 - 5 of 5 Record(s)

Hot Offer

Part Number
Brand
D/C
Qty
Price (USD)
Company
Part Number:

XC7Z030-3FBG676E

Brand:

ST/MICRON

D/C:
Qty:

1000

Price (USD):

3.505

Company:

Shenzhen WTX Capacitor Co., Ltd.

Buy
Part Number:

XC7Z030-3FBG676E

Brand:

ST

D/C:
22+
Qty:

5000

Price (USD):

4.3375

Company:

ShenZhen PengZhanSheng Electronics Co.,Ltd

Buy
Part Number:

XC7Z030-3FBG676E

Brand:

STMicroelectronics

D/C:
21+
Qty:

120

Price (USD):

5.17

Company:

NICE UPWAY INTERNATIONAL LIMITED

Buy
Part Number
Brand
D/C
Qty
Price (USD)
Company
Part Number:

XC7Z030-3FBG676E

Brand:

STMicroel

D/C:
21+
Qty:

3389

Price (USD):

1.84

Company:

Shenzhen Haoxinsheng Technology Co., Ltd.

Buy
Part Number:

XC7Z030-3FBG676E

Brand:

STMICROELECT

D/C:
21+
Qty:

800

Price (USD):

2.6725

Company:

Risetech Technology (HK) Limited

Buy

XC7Z0303FBG676E Ref.

[hkinstmicroelectronics20220620][hkinbrandcloudAMpd]
Cached Page:404;https://stmicroelectronics.hkinventory.com:443/p/details