Description
Jul 31, 2015 8GB THGBMHG6C1LBAIL . INTRODUCTION. THGBMHG6C1LBAIL is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMHG6C1LBAIL has an industry standard
Part Number | THGBMHG6C1LBAIL |
Main Category | Integrated Circuits (ICs) |
Sub Category | Memory |
Brand | STMicroelectronics |
Description | IC FLASH 64GBIT 52MHZ 153WFBGA |
Series | eMMC |
Packaging | Non-Volatile |
Memory Type | Tray |
Memory Format | FLASH |
Technology | FLASH - NAND |
Memory Size | 64Gb (8G x 8) |
Clock Frequency | 52MHz |
Write Cycle Time - Word, Page | - |
Access Time | - |
Memory Interface | MMC |
Voltage - Supply | 2.7 V ~ 3.6 V |
Operating Temperature | -25°C ~ 85°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 153-WFBGA |
Supplier Device Package | 153-WFBGA (11.5x13) |
Image |
Hot Offer
THGBMHG6C1LBAIL
STMicroel
7600
0.96
Sinway International Co., Limited
THGBMHG6C1LBAIL
STMICROELECT
7778176
1.6275
KHWY GROUP LIMITED
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ST/MICRON
3000
2.295
Hongkong Dasenic Electronic Limited
THGBMHG6C1LBAIL
ST
2000
2.9625
NAND FUND CHUEN SHING ELECTRONIC(SZ)CO.,LTD
THGBMHG6C1LBAIL
STMicroelectronics
2000
3.63
HONGKONG LIANZHENG TRADE CO., LIMITED