STMicroelectronics

Description

Semiconductor Components Industries, LLC, 2013. September, 2013 Rev. 16. 1. Publication Order Number: MJ15003 /D. MJ15003 (NPN),. MJ15004 (PNP). Complementary Silicon. Power Transistors. The MJ15003 and MJ15004 are power transistors designed for high power audio, disk head positioners and other linear CP176- MJ15003 . NPN - Power Transistor Die. 20 Amp, 140 Volt. MECHANICAL SPECIFICATIONS: Die Size. 203 x 227 MILS. Die Thickness. 12.5 MILS. Base Bonding Pad Size. 35 x 70 MILS. Emitter Bonding Pad Size. 62 x 36 MILS. Top Side Metalization. Al 50,000 . Back Side Metalization. Ag 10,000 . Scribe Alley MJ15003 . MJ15004. 150. 140. 20. 25/150. 5. 3. TO-3. NJW0281. NJW0302. 150. 260. 15. 75/150. 3. 30. TO-3P. MJ15015. MJ15016. 180. 120. 15. 20/70. 4. 3. TO- 3. 180 to 200 W. MJL21196. MJL21195. 200. 200. 16. 25/75. 8. 4. TO-264. MJW21194. MJW21193. 200. 250. 16. 20/60. 8. 4. TO-247. MJW21196. MJW21195. PRINCIPAL DEVICE TYPES. MJ15003 . GROSS DIE PER 4 INCH WAFER. 240. PROCESS CP176. Power Transistor. NPN - Amp/Switch Transistor Chip. Process . MULTI EPITAXIAL PLANAR. Die Size. 203 x 227 MILS. Die Thickness. 12.5 1.0 MILS. Base Bonding Pad Area. 35 x 70 MILS. Emitter Bonding Pad Area. Nov 30, 2000 ON Semiconductor wishes to notify its customers that SMG has been qualified as a new supplier of TO-3 glass to metal seal headers. The new headers have successfully passed 1000 hour reliability testing per AEC-Q-101 guidelines for a leadframe material/source change. The reliability tests confirmed