Description
Notes: 1. Measured at ambient temperature at a distance of 9.5mm from the case. 2. Short duration test pulse used to minimize self-heating effect. 3. Measured at SOD123. 3000/Tape & Reel. Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. Revision: 13-Aug-13. 1. Document Number: 88525. For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, Jul 21, 2017 FEATURES. Low profile package. Ideal for automated placement. Guardring for overvoltage protection. Low power losses, high efficiency. FEATURES. Low profile, axial leaded outline. High frequency operation. Very low forward voltage drop. High purity, high temperature epoxy encapsulation
Part Number | IN5819 |
Brand | STMicroelectronics |
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IN5819 S4
STMicroel
8300
1.11
Jinmingsheng Technology (HK) Co.,Limited
IN5819
STMICROELECT
9848
1.8375
HONG KONG HORNG SHING LIMITED
IN5819
ST/MICRON
180
2.565
SUNTOP SEMICONDUCTOR CO., LIMITED
IN5819
ST
11070
3.2925
CIS Ltd (CHECK IC SOLUTION LIMITED)
IN5819
STMicroelectronics
1000
4.02
RX ELECTRONICS LIMITED