Description
DATASHEET Feb 12, 2015 weight compared with the existing J-Series CT300DJH060 automotive power semiconductor module. * Pressure molding method for pouring Apr 7, 2011 This method enables manufacturers to make multiple molds simultaneously and render power modules highly reliable. CT300DJH060 4 J-Series T-PM ( CT300DJH060 ). Figure 5 shows a schematic structure of the. J- Series T-PM. The rear surfaces of the power chips. (IGBT and diode) are Jun 14, 2011 models. o Rated capacity doubles that of existing CT300DJH060 . o Increased T- PM power capacity further contributes to inverter downsizing. 17 2015 36%, 42% J- ( CT300DJH060 ). 2)
Part Number | CT300DJH060 |
Brand | STMicroelectronics |
Image |
CT300DJH060
STMicroel
25860
0.54
YU TUO (HONGKONG) TRADING CO., LIMITED
CT300DJH060
STMICROELECT
5000
1.735
XingSheng Technology (HK) Limited
CT300DJH060
ST/MICRON
66
2.93
Bonase Electronics (HK) Co., Limited
CT300DJH060
ST
11116
4.125
CIS Ltd (CHECK IC SOLUTION LIMITED)
CT300DJE090R
STMicroelectronics
11002
5.32
CIS Ltd (CHECK IC SOLUTION LIMITED)