Description
Characteristic. Symbol. Max. Unit. Thermal Resistance, Junction-to-Ambient. R JA. 200. C/W. Thermal Resistance, Junction-to-Case. R JC. 83.3. C/W. Jun 20, 2016 CP388X- BC547B . NPN - Low Noise Transistor Die. Die Size. 13 x 13 MILS. Die Thickness. 5.9 MILS. Base Bonding Pad Size. 3.9 x 3.9 MILS. BC547/BC547A/ BC547B /BC547C. NPN General Purpose Amplifier www. artschip.com. 1. This device is designed for use as general purpose amplifiers and Aug 18, 2010 INCHES. MM. DIM. MIN. MAX. MIN. MAX. NOTE. A .170 .190. 4.33. 4.83. B .170 . 190. 4.30. 4.83. C .550 .590. 13.97. 14.97. D .010 .020. 0.36. Thermal Resistance, Junction to Case. R JC. 83.3. C/W. Stresses exceeding Maximum Ratings may damage the device. Maximum. Ratings are stress ratings
Part Number | BC547B |
Main Category | Discrete Semiconductor Products |
Sub Category | Transistors - Bipolar (BJT) - Single |
Brand | STMicroelectronics |
Description | TRANS NPN 45V 0.1A TO-92 |
Series | - |
Packaging | Bulk |
Transistor Type | NPN |
Current - Collector (Ic) (Max) | 100mA |
Voltage - Collector Emitter Breakdown (Max) | 45V |
Vce Saturation (Max) @ Ib, Ic | 600mV @ 5mA, 100mA |
Current - Collector Cutoff (Max) | 15nA (ICBO) |
DC Current Gain (hFE) (Min) @ Ic, Vce | 200 @ 2mA, 5V |
Power - Max | 500mW |
Frequency - Transition | 300MHz |
Operating Temperature | 150°C (TJ) |
Mounting Type | Through Hole |
Package / Case | TO-226-3, TO-92-3 (TO-226AA) |
Supplier Device Package | TO-92-3 |
Image |
Hot Offer
BC547B
ST
53500
3.3575
JinFeng Micro Technology (HongKong) Co.,Limited
BC547B
STMicroelectronics
5000
4.45
KARMIN ELECTRONIC (HK) LIMITED
BC547B
STMicroel
15743
0.08
SUNTOP SEMICONDUCTOR CO., LIMITED
BC547B
STMICROELECT
16471
1.1725
HK HEQING ELECTRONICS LIMITED
BC547B
ST/MICRON
6500
2.265
CIS Ltd (CHECK IC SOLUTION LIMITED)